The Peek PSPI resin exhibits the following performance characteristics. Its viscosity is above 2000 cps. In terms of dimensional shrinkage, the line shrinkage is less than 3% and controllable. The elongation of the resin ranges from 5% to 8%. Regarding heat resistance, it can withstand long-term temperatures of 150~200℃ and short-term temperatures of 250~300℃. The glass transition temperature is approximately 180℃. Additionally, the molded parts made from this resin need to be heat-treated to around 200℃, and it can achieve an accuracy better than 50 microns.
Microelectronics
Connectors
Aerospace
Precision
Manufacturing
Medical Devices
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