Crossing Borders, Connecting Hearts and Chips丨SEMICON China 2026 Grandly Opens in Shanghai

On March 25, SEMICON China 2026 officially opened at the Shanghai New International Expo Center. Under the theme “Crossing Borders, Connecting Hearts and Chips,” this year’s exhibition brings together resources from the global semiconductor industry chain to comprehensively showcase innovative achievements across the entire value chain, including chip design, manufacturing, packaging and testing, equipment and materials, compound semiconductors, and advanced packaging. It stands as the Asia-Pacific region’s leading and most influential annual event in the semiconductor industry.

With an exhibition area exceeding 90,000 square meters, this year’s event attracts over 1,400 leading global companies, features more than 5,000 booths, and is expected to draw over 180,000 professional visitors. Concurrent with the exhibition, the Integrated Circuit Science and Technology Conference (CSTIC) and over 20 high-level forums and technical seminars will be held. These events will facilitate in-depth dialogue on hot topics such as advanced processes, third-generation semiconductors, chiplets, AI computing chips, automotive semiconductors, and talent development. They aim to establish channels for collaborative innovation among industry, academia, research institutions, and end-users, providing technical guidance and cooperation opportunities for the industry’s high-quality development.

As a local enterprise deeply rooted in the field of new semiconductor materials,

Heynova (Shanghai) New Material Technology CO., Ltd is also participating in the exhibition with its core products, highlighting key semiconductor materials such as photoresist monomers and high-performance polymers to demonstrate the innovative strength and development potential of domestic new materials enterprises.

Currently, the global semiconductor industry is accelerating its evolution toward high performance, low power consumption, localization, and cross-industry integration. As a core hub for China’s integrated circuit industry, Shanghai is leveraging its comprehensive industrial chain and open innovation ecosystem to continuously drive breakthroughs in key core technologies and deepen international cooperation. This exhibition not only serves as an efficient platform for technical exchange and business matching between Chinese and foreign enterprises but also underscores the Chinese semiconductor industry’s firm resolve to uphold openness and mutual benefit, working hand in hand with global partners to promote the industry’s sustainable development.

The exhibition will run through March 27, during which a series of new product launches, supply-demand matching sessions, and industry signing ceremonies will be held in rapid succession. These activities will further energize cooperation across the entire industrial chain and contribute to collaborative innovation and high-quality development in the global semiconductor industry.

HEYNOVA

an excellent service provider of key new materials and overall solutions for the global high-tech industry, focusing on the R&D and production of Polyimide monomer, Photoresist monomer & PAG, OLED monomer, Lithium battery materials, and customized services.