Dual - curing 3D printed PI Resin has the following performance characteristics. Its viscosity is less than 1000 cps when a small amount of solvent is used. The dimensional shrinkage, in terms of line shrinkage, is controllable within the range of 5 - 8%. The elongation of this resin is less than 5%. Regarding heat resistance, it can endure long - term temperatures of 180 - 220°C and short - term temperatures of 300°C. The glass transition temperature is approximately 230°C. Moreover, the molded parts made from this resin need to be heat - treated to around 300°C, and it can achieve a precision better than 50 microns.
Nanoimprinting,
Insulating and Temperature-resistant parts
Support Structure Parts
Microelectronic
Photosensitive Adhesive
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