Heynova is an agent for polyimide resin (powder). At present, there are five series of PI products: Basic, Modified, Functional, Filled and Soluble. They are used for processing profiles (plates, rods, tubes, etc.) and finished parts. The finished products are mainly used for manufacturing gaskets, bearings, valve seats, seals, transmission parts, insulating parts and other parts, which are widely used in the fields of aerospace, military, electronics and electrical appliances, chip semiconductors, automobiles, precision instruments, industrial robots, plasma cutting and so on.
Polyimide (PI) filled polytetrafluoroethylene (PTFE) composite materials combine the high temperature stability of PI with the excellent lubricity of PTFE to form a unique combination of properties specifically designed for extreme operating conditions. Through material gene design, operating condition-adapted modification, and full life cycle performance verification, Heynova's PI/PTFE composite materials are redefining the application standards for high-performance polymers in harsh environments.
As an engineering plastic, PI/PTFE is slightly lacking in chemical resistance, it is not resistant to alkali and hot concentrated acid, nor hydrolysis, but in the dry friction environment wear resistance, it is significantly better than similar products polyphenylene ester reinforced polytetrafluoroethylene, especially suitable for dry friction in the absence of chemical corrosive environments under the working conditions.
In order to improve the mechanical properties of polytetrafluoroethylene (PTFE) at high temperature, and wear resistance and dimensional stability, we mainly use such as PI and polytetrafluoroethylene (PTFE) alloying treatment, our conventional mixing ratio of 80% PTFE, 20% PI. RPTFE is a multivariate composite material, the ratio of components can be adjusted according to the actual customer working conditions, not fixed. The products are mainly used for piston rings, oil-free gas pump bowls, bushings, shaft tiles, sealing gaskets and other parts.
MPI-modified polyimide resin is a modified polyimide material with excellent insulating properties, high temperature stability, good mechanical properties, etc. It is widely used in aerospace, electronic information, biomedical and other high-tech fields.
The modification process of MPI-modified polyimide resins involves optimizing and adjusting the molecular structure of the resin. This includes the introduction of different functional groups, changing the arrangement of molecular chains, and copolymerization with other materials. Through these modifications, the various properties of polyimide resins can be effectively improved to meet the requirements of specific applications.
Improved thermal stability: Through the introduction of specific chemical groups and structures, the thermal decomposition temperature of the resin is increased, so that it can still maintain good performance in high temperature environments.
Enhanced mechanical properties: By optimizing the molecular structure and introducing reinforcement, the tensile strength, impact resistance and wear resistance of the resin are improved.
Improvement of insulation properties: The modified polyimide resin has better insulation properties and can better meet the high insulation requirements of electronic equipment.
Good processing performance: The modified resin has better fluidity, adhesion and filler during processing, which helps to improve the molding quality and production efficiency.
Wide range of applications: MPI resin can be used in aerospace, electronic information, biomedical and other fields, providing important material support for the development of these fields.
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