MPI-modified polyimide resin is a modified polyimide material with excellent insulating properties, high temperature stability, good mechanical properties, etc. It is widely used in aerospace, electronic information, biomedical and other high-tech fields.
The modification process of MPI-modified polyimide resins involves optimizing and adjusting the molecular structure of the resin. This includes the introduction of different functional groups, changing the arrangement of molecular chains, and copolymerization with other materials. Through these modifications, the various properties of polyimide resins can be effectively improved to meet the requirements of specific applications.
Improved thermal stability: Through the introduction of specific chemical groups and structures, the thermal decomposition temperature of the resin is increased, so that it can still maintain good performance in high temperature environments.
Enhanced mechanical properties: By optimizing the molecular structure and introducing reinforcement, the tensile strength, impact resistance and wear resistance of the resin are improved.
Improvement of insulation properties: The modified polyimide resin has better insulation properties and can better meet the high insulation requirements of electronic equipment.
Good processing performance: The modified resin has better fluidity, adhesion and filler during processing, which helps to improve the molding quality and production efficiency.
Wide range of applications: MPI resin can be used in aerospace, electronic information, biomedical and other fields, providing important material support for the development of these fields.
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