Thermal decomposition temperature >500°C, long-term temperature resistance over 300°C (aerospace-grade standard).
Coefficient of thermal expansion (CTE) 3-20 ppm/°C, perfect match with silicon wafers/metal (solving the problem of chip package warpage).
Tensile strength >200MPa, modulus >3GPa (equivalent to steel strength/weight ratio).
Flexibility-rigidity adjustable: Performance coverage from foldable screen to structural components through monolithic structure design.
Resistant to strong acids/alkalis (e.g. hydrofluoric acid, concentrated sulfuric acid).
Radiation resistant (for satellite PI film can withstand 10⁶ Gy radiation dose).
Dielectric constant (Dk) 2.5-3.2 (ideal material for 5G high-frequency signal transmission).
Volume resistivity >10¹⁶ Ω·cm (key indicator for chip package insulation layer).
The opening of 5G era, spurred PI film application demand, MPI for 5G era mobile phone antenna core film material. From 4G to 5G transition MPI material will occupy a certain market advantage.
Due to the good bio-compatibility and high temperature resistance of polyimide, it is used to make medical devices and biomedical materials. It can be used to make artificial joints and dental implants.
Gas separation membrane is the use of polyimide film to selectively ‘filter’ the feed gas to achieve the purpose of separation to protect environment. The main applications are hydrogen recovery and purification from refinery gas.
Polyimide is widely used in the manufacture of high-precision electronic components. It can be used as the matrix material for the production of flexible printed circuit boards (FPC), also to make the insulating layer of wires and cables.
Polyimide is a high-performance material commonly used in aerospace vehicles. It is widely used in aerospace manufacturing and in various components of aircraft such as air-frame materials, composite matrices, and engine parts.
The application scenarios of PI materials mainly including: in-vehicle display, in-vehicle semiconductor protection and packaging, motor insulation and protection, power battery insulation and protection, and automotive flexible circuit board (FPC) materials.
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