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Film loss during photolithography of thick-film photosensitive polyimide (PSPI, ≥10 μm) can be broadly divided into two parts: during the development stage, organic developer penetrates the cross-li...

Selecting a photoacid generator requires more than choosing the strongest acid or highest stated quantum yield. The PAG must respond to the intended exposure source, catalyze the required resin reacti...

As chip manufacturing processes advance toward the 2 nm and 1 nm nodes, traditional chemical amplification resist (CAR) is gradually reaching its performance limits. Issues such as low EUV photon abso...

PMDA, or pyromellitic dianhydride, and 6FDA are aromatic dianhydrides used to build high-performance polyimides, but they solve different formulation problems. PMDA is usually the stronger starting po...

Applications of PSPI in Semiconductors and OLEDsIn the semiconductor industry, PSPI can be used for wafer passivation and stress relief layers. Negative-develop PSPI can form films ranging from severa...

Photosensitive polyimide (PSPI) combines the excellent heat resistance, mechanical properties, and electrical insulation of polyimide with photolithographic patterning capabilities. By introducing pho...

For a long time, improvements in integrated circuit performance have relied primarily on Moore’s Law, which states that the number of transistors that can be accommodated on an integrated circuit dou...

Functional Mechanism and Technical Advantages of the Si-BARC Silicon-Based Anti-Reflection CoatingSi-BARC (Silicon-Based Anti-Reflection Coating) serves as the central functional layer in a three-laye...

Against the backdrop of continuous scaling in advanced semiconductor processes, 193 nm immersion lithography has long supported the mass producti...

In the fields of semiconductor and micro-nano manufacturing, lithography technology is the cornerstone that defines the precision structures of chips and optical devices. While EUV and DUV lithography...