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Photoresist solvents are key components in photoresist formulations, primarily serving to dissolve solid constituents such as resins, photoinitiators, and additives into a uniform, stable liquid photo...

Polyimide resin is a high-performance polymer featuring an imide ring in its main chain. It combines exceptional high-temperature resistance, high mechanical strength, outstanding dielectric propertie...

OLED intermediates serve as the core building blocks for synthesizing functional materials in organic light-emitting diodes (OLEDs). They act as the critical link between basic chemical raw materials ...

Photoresist monomers are the core raw materials forming the backbone of photoresist resins. Their molecular structures determine key properties such as light transmittance, etch resistance, and acid s...

Photoactive Compounds (PAC) are a class of substances that undergo photodecomposition, cross-linking, isomerization, and other chemical reactions when exposed to light of specific wavelengths. These r...

Thermal graphite film is a novel thermal management material, also known as thermal graphite sheets or heat dissipation graphite film. Its primary component is carbon, featuring a unique layered hexag...

Traditional polyimides exhibit a brownish-yellow color in the visible light spectrum due to charge-transfer complexes (CTCs) within their molecular structure. Transparent polyimides suppress CTC forma...

Optical Proximity Effect (OPE) in lithography refers to the deviation between the actual pattern formed on photoresist and the designed pattern on the mask plate, caused by optical phenomena such as d...

The Bottom Anti-Reflection Coating (BARC) is an essential supporting material in deep ultraviolet (DUV) and extreme ultraviolet (EUV) lithography processes. Applied between the photoresist and the waf...

The solubility of polyimide (PI) is one of the core bottlenecks in its processing and application. The polyimide molecular chain contains a large number of rigid aromatic ring structures, and strong h...